Microhardness and Penetration of Artificial White Spot Lesions Treated with Resin or Colloidal Silica Infiltration JC05-JC09
Dr. Jyothi Mandava,
Professor and Head, Department of Conservative Dentistry and Endodontics, GITAM Dental College and Hospital,
Rushikonda-530045, Visakhapatnam, Andhra Pradesh, India.
Introduction: Infiltration of early enamel lesions by materials having remineralizing capacity seems to improve aesthetics and arrests caries progression.
Aim: To evaluate and compare the surface microhardness and penetration depth of a low viscosity resin and colloidal silica nanoparticle infiltrates into artificially created white spot lesions.
Materials and Methods: Forty extracted human central incisors were embedded in acrylic resin blocks exposing the labial surfaces of the crowns. The specimens were immersed in demineralizing solution for 96 hours to create white spot lesions on labial surfaces. The samples were then divided into two groups (n=20 each), where in Group 1-resin infiltration (ICON DMG, Hamburg, Germany) and Group 2-colloidal silica infiltration (Arrow Fine chemicals, Rajkot, Gujarat, India) was done. Samples were subjected to vickerís microhardness testing at baseline, after demineralization and after treatment with resin or colloidal silica infiltrates. Then, the crowns were sectioned longitudinally and penetration depth of the infiltrants was measured using confocal laser scanning microscope and compared the readings to lesion depth. All the collected data was subjected to statistical analysis using t-test.
Results: Resin infiltration group showed significantly greater increase in microhardness compared to colloidal silica infiltration (p=0.001). The percentage of penetration of the resin group was 67.14% and that of colloidal silica group was 54.53% indicating significant difference between the two.
Conclusion: Resin infiltrates performed better in regaining the baseline microhardness and penetrating deep into the porous white spot lesions, when compared to colloidal silica infiltrates.