Comparative Evaluation of Microshear Bond Strength of Adhesive Resin Incorporated with Inorganic Nanofillers Cerium Dioxide: An In-vitro Study
Dr. Pallavi Sharad Suryarao,
Postgraduate Student, Department of Preventive and Paediatric Dentistry, School of Dental Sciences, Krishna Institute of Medical Sciences, Karad-415110, Maharashtra, India.
Introduction: Dental adhesives are used for a wide range of clinical applications in dentistry. Bonding is required in direct composite resin restorations. In clinical situation, resin to dentin bonds are less resistant than resin to enamel bonds. Because of varying structure and composition of dentin, the failure of resin-dentin bonding resulting in staining, caries recurrence microleakage. These set of circumstances can hasten the failure and degradation of resin to dentin bonding hence inorganic fillers can be added to improve the bond strength. Cerium dioxide (CeO2) is a rare earth oxide has been increasingly used as a nanotherapeutic material and can be successfully used in adhesive resin to improve the physical properties of adhesive resin.
Aim: To evaluate and compare microshear bond strength of adhesive resin after incorporation of inorganic nanofillers cerium dioxide.
Materials and Methods: This in-vitro study was conducted in Department of Preventive and Paediatric Dentistry at School of Dental Sciences, Krishna Institute of Medical Sciences, Karad, Maharashtra, India, from February 2022 to April 2022. The unfilled dental adhesive was used as a control (group A) and dental adhesives formulated with nanosized Cerium dioxide (CeO2) as the inorganic filler (group B). Total 24 samples were prepared, 12 samples in each group and adhesives were evaluated for microshear bond strength. Intragroup comparison between experimental and control group was done using Unpaired t-test.
Results: The mean microshear bond strength of the adhesive system containing nanosized cerium dioxide at a concentration of 2% was 6.89±2.22 MPa (group B), which was significantly greater than that of the adhesive system without additives (group A) 4.37±1.22 MPa.
Conclusion: Microshear bond strength of the dental adhesives with nanosized CeO2 particles, was significantly higher than the unfilled adhesive.